CTIA WIRELESS 2013, USA: 4G chipmaker Sequans Communications S.A. has introduced a new line of LTE modules called EZLinkLTE.
The modules are based on Sequans’ LTE baseband chip and include a complete RF front end and key interfaces in a single, compact package. EZLinkLTE modules give device designers a plug-and-play, all-in-one LTE connectivity solution that significantly reduces development cost and time to market.
The first EZLinkLTE module, sampling now, is the VZ20Q, which is one of the first modules in the industry to support both LTE bands 4 and 13. The new module will be on display at CTIA 2013 in Sequans’ booth 2836 through May 23.
The baseband chip at the heart of the new module is Sequans’ SQN3120 Mont Blanc chip that was certified by Verizon Wireless in 2012. The chip is compliant with 3GPP release 9 and it delivers category 4 throughput of up to 150 Mbps in the downlink. Starting with the SQN3120 chip, the VZ20Q integrates all other elements necessary for a complete LTE modem system.
These include an LTE-optimized RF transceiver provided by Sequans’ RF partner, Fujitsu Semiconductor, a complete dual-band RF front-end for bands 4 and 13, LP-DDR SDRAM, embedded boot Flash, and VC-TCXO, all in a single, surface-mountable package with a very compact footprint, 17 x 24 x 2 mm.