OIF to demo multi-vendor interoperability

OFC/NFOEC 2012, FREMONT, USA: Ten Optical Internetworking Forum (OIF) members are uniting to showcase multi-vendor participation in OIF Interoperability 2012 – Enabling High-Speed Dynamic Services.

The OIF’s Physical and Link Layer (PLL) demonstration will showcase interoperability of the Forum’s Common Electrical Interface (CEI) 28G Very Short Reach (VSR) draft implementation agreement that defines chip-to-module electrical interfaces. Demonstrations of the CEI-25G-LR signal for backplane interfaces will also be tested. These demonstrations will be on display at OFC/NFOEC, March 6-8 at the OIF booth #713.

“This demonstration of CEI-28G-VSR shows the ability to reach 100G for next-generation 4 x 25Gb/s based optical transceivers,” said Ed Frlan of Gennum and the OIF PLL Interoperability Working Group chair. “The CEI-25G-LR and CEI-28G-VSR electrical interface and signaling schemes being tested for interoperability support multiple 100G applications.”

The following companies are participating in the OIF Interoperability 2012; Altera, Amphenol, Fujitsu Optical Components, Gennum, IBM, Inphi, Luxtera, Molex, TE Connectivity and Xilinx. Various equipment used during the testing includes host IC with VSR SERDES, host PCB traces, optical module connectors, module retimers and optical transceivers. Test equipment used in the demonstration is supplied by Tektronix Inc.

“This interoperability test and demonstration shows a critical mass – with multiple vendors supporting the CEI-28G-VSR,” said Rod Smith of TE Connectivity and the OIF Marketing Awareness & Education Committee co-chair. “There is momentum in the marketplace to incorporate higher speed signals.”