Mindspeed and Radisys to demo integrated hardware and software platform for LTE small cell base stations

Mobile World Congress 2012, NEWPORT BEACH, USA: Mindspeed Technologies Inc. and Radisys Corp., a leading provider of embedded wireless infrastructure solutions, announced that the companies will showcase long-term evolution (LTE) base station advances at Mobile World Congress 2012 at Mindspeed's booth (1E.57) at the Fira Montjuïc in Barcelona, Spain from February 27 to March 1, 2012.

The companies will demonstrate a commercially-available eNodeB small cell reference design based on a single SoC. The design utilizes Mindspeed’s carrier-class L1 PHY software and production-grade Transcede 4000-series SoC. Radisys will highlight its fully integrated Trillium LTE TOTALeNodeB software with the Mindspeed Transcede SoC processors to support the demonstration.

The Trillium LTE wireless software provides TEMs with a complete, integrated LTE eNodeB and meets the unique requirements of the network equipment provider. It includes the Trillium LTE eNodeB application, radio resource management (RRM), radio environment monitoring (REM), self-organizing network (SON), schedulers and all of the Trillium protocol layers and stretches from all variations of small cells up to macro cells.

“Mindspeed's Transcede families of processors are a strong solution for small cell access stations. We are working jointly to support multiple customer deployments and have joint engagements that will achieve deployment in the near future. We are also excited about the opportunity to collaborate with Mindspeed in the Picochip integration to deliver a dual mode solution,” said Todd Mersch, product line management director at Radisys.

Mindspeed’s Transcede family of processors are complete NodeB and eNodeB SoC solutions that support concurrent 3G and LTE processing in a single device, including time division synchronous code division multiple access (TD-SCDMA), wideband code division multiple access (WCDMA)/ evolved high-speed packet access (HSPA+) and both frequency division duplexing LTE (FDD-LTE) and time division duplexing LTE (TDD-LTE), with a roadmap to LTE-Advanced (LTE-A).

Combining 3G and LTE processing capabilities into a single chip is more cost effective for original equipment manufacturers (OEMs), and the inclusion of a carrier-class physical-layer (PHY) software solution for both 3G and LTE will accelerate time to market, while simplifying development and reducing risk.