Plasma-Therm receives repeat order from wireless chip manufacturer

ST. PETERSBURG, USA: Plasma-Therm LLC, a global supplier of plasma process equipment, is pleased to announce the sale of another multi-chamber VERSALINE production system for etch and deposition to a leading North American wireless compound semiconductor manufacturer.

The process modules include an Inductively Coupled Plasma (ICP) etcher for additional capacity for advanced backside GaAs via formation. A second module utilizes Plasma Enhanced Chemical Vapor Deposition (PECVD) for highly controllable, low damage, low stress silicon nitride deposition for demanding applications such as capacitors and passivation. Each process chamber includes Plasma-Therm’s EndPointWorks technology to ensure maximum via etch yield and real-time film thickness monitoring. These orders compliment an installed base of Plasma-Therm VERSALINE and Versalock equipment at this site.

“Plasma-Therm has been an integral equipment supplier for wireless chip manufacturers for many years. Repeat orders based on a history of reliable, superior performance affirm our abilities to providing outstanding solutions to challenging compound semiconductor manufacturing issues,” explains Ed Ostan, senior VP of Marketing. “Our wireless device manufacturing customers are attracted by the breadth and depth of our technology spanning etch and deposition processes and our collaborative efforts with customers to ensure maximum value.”