CIOE 2011, NEWPORT BEACH, USA: Mindspeed Technologies Inc., a leading supplier of semiconductor solutions for network infrastructure applications, will demonstrate one of the industry’s most extensive families of end-to-end fiber-optic physical media devices (PMD) at the China International Optoelectronic Exposition (CIOE) from September 6-9, 2011, in Booth #B670/672 at the Shenzhen Exhibition and Convention Center in Shenzhen, China.
“CIOE in China is an ideal venue for highlighting our latest burst mode transimpedance amplifiers and our broad family of complementary components and complete chipset solutions,” said Angus Lai, product marketing director of the high-performance analog (HPA) business unit at Mindspeed. “This region is experiencing rapid growth in the build-out of its fiber-optic infrastructure, and we will be demonstrating products that simplify designs and help speed the deployment of fiber-to-the-x (FTTx) networks while delivering unique performance and cost advantages.”
Mindspeed will showcase a number of products at CIOE, including a new, 1.25 gigabit per second (Gbps) burst mode transimpedance amplifier (TIA) for central-office-side optical line termination (OLT) equipment in Gigabit Ethernet PON (GEPON) applications. The M02038 TIA can be used with the company’s M02052 burst mode post amplifier as a complete OLT module solution. Mindspeed also offers the M02028 high sensitivity continuous-mode 1.25 Gbps TIA which can be used with the company’s previously announced M02098 burst mode laser driver for subscriber-side optical networking unit (ONU) equipment.
Mindspeed will also feature an end-to-end demonstration of its comprehensive solution for 10 Gigabit Ethernet PON (10G-EPON) applications, including its M02138 burst mode TIA and M02172 modulator laser driver for OLT equipment, and its M02170 burst-mode laser driver for ONU equipment. Each chipset is complemented by Mindspeed’s M02142 post-amplifier to create a complete solution on either side of the link.
Mindspeed’s TIAs and other PMDs can be implemented in a small form factor (SFF) or small form factor pluggable (SFP) optical transceiver, or with a bi-directional optical sub-assembly (BOSA) that can be mounted directly onto the board to further reduce overall bill-of-material costs.