MOUNTAIN VIEW, USA: CEVA Inc., the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, announced that it is the first company in the semiconductor industry to offer a Dolby approved DSP core implementation of Dolby Mobile.
Based on the high-performance CEVA-TeakLite-III DSP, CEVA's implementation of the third generation Dolby Mobile technology, including support of Dolby Digital Plus for mobile, enables a significant time-to-market advantage and power consumption savings for customers designing mobile audio processors incorporating Dolby's latest mobile audio enhancements.
Dolby Mobile is designed to give consumers a rich, full-impact audio experience on portable devices. Designed for easy, flexible implementation, Dolby Mobile allows device makers to enable a multitude of stunning audio settings, including full 5.1-channel HD audio, mobile surround and natural bass.
Many of these impressive features require DSP-intensive, audio post-processing techniques to be performed in real-time on the mobile device, and call for a high-performance DSP-based audio processor architecture for efficient implementation. The CEVA-TeakLite-III DSP based implementation consumes up to 5X less power than today's CPU-based alternatives, delivering critical power savings and extending battery life for Dolby Mobile-enabled devices, such as smartphones and tablets.
"The availability of our Dolby Mobile technology on the CEVA-TeakLite-III DSP constitutes a compelling solution for customers designing advanced mobile audio processors," said Patrick Flanagan, director of Product Marketing, Mobile Ecosystem, Dolby Laboratories. "CEVA's low power DSP architecture enables Dolby Mobile to efficiently deliver the advanced audio that consumers demand, without sacrificing battery-life of the target device."
"CEVA is proud to be the first company to offer the latest generation Dolby Mobile for a DSP core, providing our customers with a significant time-to-market advantage for mobile audio SoC designs," said Eran Briman, VP of marketing at CEVA. "Further, with the CEVA-TeakLite-III, we have demonstrated clear performance and power consumption advantages when implementing advanced mobile audio processing, addressing one of the most critical issues in mobile SoC design today."
The provision of the third generation of the Dolby Mobile was achieved using actual CEVA-TeakLite-III silicon, providing CEVA customers with a silicon-proven hardware and software solution that streamlines the overall design cycle for advanced mobile audio processors.
CEVA-TeakLite-III is a native 32-bit, high performance DSP core, used in mobile baseband and application processor chips, to handle, among other tasks, advanced mobile audio scenarios, such as multi-stream audio playback with various post-processing functions for enhanced audio experience. The DSP solution includes a configurable cached memory subsystem, a comprehensive set of optimized HD audio codecs, and complete software development kit, including software development tools, prototype boards, test chips, system drivers and RTOS.
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