Thursday, December 8, 2011

Telenet Systems adopts sequans’ new gen LTE semiconductor solutions for LTE devices in India

India Telecom 2011, NEW DELHI, INDIA: 4G chipmaker Sequans Communications S.A. has announced that Telenet Systems, a Mumbai-based designer and manufacturer of communications products, will build TD-LTE USB dongles and desktop CPE based on Sequans’ new generation LTE semiconductor solutions. The new devices will be used in TD-LTE operator trials and commercial deployments coming soon in India.

“Sequans’ new LTE solutions incorporate the latest advances in LTE semiconductors,” said Nita Mehta, MD, Telenet Systems. “The highly integrated Sequans’ LTE chips provide us with key features, such as an integrated applications processor, that enable us to design and deliver high performing TD-LTE devices to operators and consumers in India.”

Telenet is using Sequans’ SQN3120 LTE baseband chip and SQN3140 TDD RFIC to design the new products. The SQN3120 is part of Sequans’ new generation Mont Blanc LTE platform, which is designed especially for use in USB dongles and CPE. The SQN3120 is built in 40 nm, low power CMOS process and includes an integrated customer-programmable applications processor and SDRAM in a very small 10 x 10 mm package. It is 3GPP R9 compliant, delivering up to 150 Mbps of throughput. The SQN3140 RFIC is an integrated direct conversion RF solution built in 40 nm CMOS and delivered in a 7 x 7 mm package.

“The launch of 4G TD-LTE service in India is imminent as numerous operators launch trials and head toward full commercial deployment in the coming months,” said Georges Karam, Sequans CEO. “We are very pleased to contribute our technology to Telenet and to help accelerate this exciting momentum.”

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