PARIS, FRANCE & SHANGHAI, CHINA: 4G chipmaker Sequans announced that Sequans-powered TD-LTE USB dongles performed successfully as part of China Mobile’s end-to-end TD-LTE demonstration network that debuted at World Expo 2010 in Shanghai, May 1.
China Mobile selected Sequans to provide TD-LTE chips and USB dongles for this revolutionary technology demonstration that was designed to show the world a real-life performance of a TD-LTE network.
China Mobile is covering several major pavilions at the Shanghai Expo with the TD-LTE service. During the demonstrations, Sequans’ small, commercial-sized TD-LTE USB dongle delivered high definition video for an audience of China Mobile executives, and high throughput for an audience of editors and analysts attending the debut event.
“We are very pleased and proud to collaborate with China Mobile on this major achievement,” said Georges Karam, Sequans CEO. “The successful demonstration shows the great potential of TD-LTE technology and that it can certainly become a global technology standard.”
The USB dongles used for the demo are powered by Sequans’ SQN3010 baseband SOC. The chip is designed to comply with the 3GPP R8 standard, supporting UE category 3 throughput of 100 Mbps in a 20 MHz channel, and LTE band classes 38 and 40.
“We have taken an early lead in the development of LTE silicon and our participation in the world’s first TD-LTE demonstration network shows our commitment to becoming a valued supplier to China Mobile and the worldwide TD-LTE ecosystem,” said Karam.