WESTLAKE, USA: Nordson Corp.'s Advanced Technology segment offers electronics manufacturers a comprehensive selection of fluid dispensing, conformal coating, underfilling, bond testing and inspection solutions that will increase yields and reduce production costs.
The Advanced Technology segment consists of Nordson’s ASYMTEK, DAGE, EFD and YESTECH product lines, which are used to assemble many elements in mobile phones and tablets, such as camera modules, MEMS devices, speakers, touch panels, keypads, displays, SMT boards and housings.
The companies will be demonstrating their latest technologies at the NEPCON South China tradeshow in Shenzhen, China, August 30 through September 1, 2011. Engineers will be available to discuss attendees' mobile device manufacturing issues and demonstrate new ways to increase throughput and yields while reducing production costs. Attendees can also schedule complimentary appointments to discuss their applications in detail.
“Only Nordson is able to offer so many industry-leading technologies from a single source,” states Greg Wood, Nordson’s VP for Advanced Technology Systems, Asia. “These high-quality solutions provide real value to customers and can help drive their productivity and profitability to higher levels.”
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