TAIPEI, TAIWAN: Qualcomm Inc. will be unveiling new advances in mobile connectivity and capabilities powered by its Snapdragon platform at the COMPUTEX TAIPEI 2009 show, taking place June 2-6, 2009.
The company's device manufacturing partners will be showcasing a wide range of devices powered by Snapdragon chipsets. Qualcomm also will be sharing its vision for a new category of mobile devices called 'smartbooks' that bring a new level of always-on connectivity, ultra-portability and powerful performance to mobile users.
“Consumers are looking for devices that offer more instantaneous connectivity, greater mobile performance and intuitive usability than ever before,” said Luis Pineda, senior vice president of marketing and product management at Qualcomm CDMA Technologies. “Qualcomm's Snapdragon platform is addressing those needs by enabling smartphones that break new ground in mobile capability, and establishing this new category of smartbooks -- devices which deliver a unique mobile user experience different from anything else on the market today.”
Demonstrations available for viewing by appointment include Snapdragon-based devices from ASUS, Compal Communications Inc., Foxconn, High Tech Computer (HTC), Inventec, Toshiba and Wistron.
“HTC has a long history of exceptionally innovative mobile device designs,” said Peter Chou, chief executive officer of HTC. “We feel the Snapdragon platform from Qualcomm holds great promise, and look forward to collaborating on groundbreaking new consumer products that redefine what is possible on a mobile device.”
“The mobile industry is evolving, and it's become apparent that consumers are more sophisticated in their expectations than ever before,” said Stephen Chen, president of Compal Communications Inc. “The Snapdragon platform's integrated 3G mobile broadband brings a new level of connectivity and convenience to the smartphone and smartbook categories.”
“Inventec has a strong relationship with Qualcomm, developing new types of mobile products by combining our respective strengths,” said Mark Hirsch, VP Corporate Marketing, Inventec Corp. “Snapdragon chips are making possible an entirely new product category that should have strong appeal to both younger trendsetters and mobile professionals.”
“Quanta has always strived to deliver leading-edge technology to the market,” says Alan Tsai, the senior vice president of Business Group 2 of Quanta Computer Inc. “Thanks to the unprecedented performance of Qualcomm's Snapdragon chipsets, we look forward to delivering a new type of user experience to the market.”
“Wistron has always prided itself on its innovation and quality leadership within the industry,” said Eric Huang, GM of the Handheld Device BU of the Mobile Business Group at Wistron Corp. “Qualcomm's new Snapdragon chipsets allow us to offer a variety of innovative mobile devices in creative new form factors with unsurpassed usability and wireless connectivity.”
Smartbooks are a new class of devices running mobile operating systems that bridge the functional divide between smartphones and laptops, delivering the best aspects of a smartphone experience on a larger-display form factor.
Constantly connected via 3G, Wi-Fi and GPS, smartbooks are ultra-portable, personalizable, easy-to-use and last all day on a single battery charge. Qualcomm's Snapdragon platform has a unique combination of capabilities that makes it exceptionally competitive in the smartbook category, which is redefining mobility for consumers at productivity and play.
Qualcomm also offers the Plaza Retail complete application retail solution, the latest addition to the Plaza solution suite that aims to deliver on Qualcomm's goal of supporting all major mobile application platforms across a wide variety of devices and networks.
The Snapdragon family includes the original 1 GHz QSD8x50 chipsets, the new 45nm 1.3 GHz QSD8650A with a wide range of performance and power enhancements, and the QSD8672 with dual CPUs capable of up to 1.5 GHz for faster response and processing. More than 15 manufacturers are now developing more than 30 Snapdragon-based products.
Showing posts with label Foxconn. Show all posts
Showing posts with label Foxconn. Show all posts
Tuesday, June 2, 2009
Sunday, April 26, 2009
Rules change in mobile handset outsourcing business: iSuppli
EL SEGUNDO, USA: With the structure of the mobile handset supply chain upended by the global economic crisis, the old rules for the contract manufacturing of wireless devices have been overturned, leaving new pitfalls for OEMs and EMS providers, according to iSuppli Corp.
One major rule change is that the contract manufacturing business can no longer count on incremental growth in outsourced production from all wireless OEMs.
"Until recently, the contract manufacturing industry yielded consistent double-digit year-over-year growth rates in mobile handset outsourcing,” said Jeffrey Wu, senior analyst, EMS/ODM for iSuppli. “However, the uncertainty in the marketplace now is forcing some OEMs to not only decelerate outsourcing but also to reclaim production by moving it in-house. Nokia, for instance, is one such OEM."
In 2008, Nokia decreased the percentage of its outsourced manufacturing volume to 17.1 percent, down from 21.5 percent in 2007. The attached figure presents the balance of in-house and outsourced manufacturing at Nokia from 2005 to 2008.
“This reflects a larger trend in the mobile-handset supply chain,” Wu said. “Decelerating and decreasing outsourced manufacturing by those OEMs that are still operationally competent will hurt the growth prospects of contract manufacturers.”
Thus, as EMS and ODM providers mull their future strategies, they should not fall into the trap of assuming continued strong growth in production outsourcing among mobile-handset OEMs.
Vertical structure goes flat
Looking at another potential pitfall, the success of Foxconn International Holdings (FIH) in recent years has spurred other EMS firms to emulate the company’s vertical supply chain structure, including component procurement.
FIH’s extensive integration of various nodes of the supply chain into its operations often was credited as a key contributor to the company’s success and its rise to the leading position in the global EMS market. However, the halo surrounding FIH disappeared in 2008 and was replaced by a series of disappointing financial announcements.
"When the economy is going strong and market demand is vibrant, the vertically integrated model can help an EMS provider grow because the economies of scale can be leveraged internally, and the manufacturing business and the component business can subsidize each other," Wu said. "But when the order volume drops, this model doesn’t allow a lot of flexibility for the manufacturing arm and prevents it from sourcing to external component suppliers easily. Thus, the vertical integration model is like a double-edged sword, helping an EMS provider to compete better when the market grows, but making it suffer more when the economy stagnates."
Because of this, EMS firms may want to avoid the hazard of adopting FIH’s vertical structure amid the market downturn.
One major rule change is that the contract manufacturing business can no longer count on incremental growth in outsourced production from all wireless OEMs.
"Until recently, the contract manufacturing industry yielded consistent double-digit year-over-year growth rates in mobile handset outsourcing,” said Jeffrey Wu, senior analyst, EMS/ODM for iSuppli. “However, the uncertainty in the marketplace now is forcing some OEMs to not only decelerate outsourcing but also to reclaim production by moving it in-house. Nokia, for instance, is one such OEM."
In 2008, Nokia decreased the percentage of its outsourced manufacturing volume to 17.1 percent, down from 21.5 percent in 2007. The attached figure presents the balance of in-house and outsourced manufacturing at Nokia from 2005 to 2008.
“This reflects a larger trend in the mobile-handset supply chain,” Wu said. “Decelerating and decreasing outsourced manufacturing by those OEMs that are still operationally competent will hurt the growth prospects of contract manufacturers.”
Thus, as EMS and ODM providers mull their future strategies, they should not fall into the trap of assuming continued strong growth in production outsourcing among mobile-handset OEMs.
Vertical structure goes flat
Looking at another potential pitfall, the success of Foxconn International Holdings (FIH) in recent years has spurred other EMS firms to emulate the company’s vertical supply chain structure, including component procurement.
FIH’s extensive integration of various nodes of the supply chain into its operations often was credited as a key contributor to the company’s success and its rise to the leading position in the global EMS market. However, the halo surrounding FIH disappeared in 2008 and was replaced by a series of disappointing financial announcements.
"When the economy is going strong and market demand is vibrant, the vertically integrated model can help an EMS provider grow because the economies of scale can be leveraged internally, and the manufacturing business and the component business can subsidize each other," Wu said. "But when the order volume drops, this model doesn’t allow a lot of flexibility for the manufacturing arm and prevents it from sourcing to external component suppliers easily. Thus, the vertical integration model is like a double-edged sword, helping an EMS provider to compete better when the market grows, but making it suffer more when the economy stagnates."
Because of this, EMS firms may want to avoid the hazard of adopting FIH’s vertical structure amid the market downturn.
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