Sequans unveils next-generation FDD and TDD LTE chips and global LTE platforms

4G World 2011, PARIS, FRANCE: 4G chipmaker Sequans Communications S.A. has introduced three new FDD and TDD LTE baseband chips, a companion RF chip, and two new LTE platforms, supporting all global FDD and TDD LTE networks.

The chips represent the state of the art in LTE semiconductor technology. They are designed in 40 nm CMOS process technology and deliver industry-leading low power consumption and high performance in a very small form factor. The new baseband chips, along with RF chips, reference designs and comprehensive software, comprise one of two platforms Sequans has designed to support two distinct market segments. The first platform, Andromeda, is customized for the design of handsets and tablets, and the second, Mont Blanc, is customized for the design of mobile hotspots, USB dongles and CPE modems.

“We are pleased and proud to offer these powerful, yet highly energy and cost efficient LTE platforms to our global customers,” said Georges Karam, Sequans CEO. “These platforms are based on our second generation LTE technology, incorporating the latest advances in LTE semiconductor science and reflecting our many years of experience in 4G, working with operators and manufacturers all over the world. Our new LTE platforms are uniquely comprehensive, supporting all global TDD and FDD networks from 700 MHz to above 3.5 GHz, and designed to meet the needs of device manufacturers for all types of devices in the most efficient way possible.”